Universidad Politécnica de Valencia (UPVLC) - Nanophotonics Technology Center

The Valencia Nanophotonics Technology Center (NTC) is a research institute at the Technical University of Valencia, Spain, leader in Europe in knowledge generation, development and integration of innovative photonics technologies and systems. Its mission is to generate new knowledge in micro/nanofabrication of structures on Silicon and Silicon related technologies for the development of nanotechnology and nanoscience, specially, towards their applications in photonics in areas like: optical fibre networks and systems, biophotonics, defence, security, photonic computation, photovoltaics, etc.

The NTC facility is hosted by the UPV at its city campus in Valencia. It is composed by a multidisciplinary scientists and engineers team from several academic research groups in Spain. Skilled scientists and technicians coming from the Agere Systems factory in Madrid, Pirelli Labs-Milano and Infineon have joined the NTC providing professional fabrication services. The NTC facility includes a 500 sqm clean room (class 10-100) for 6” Si wafer processing. Available processes are: lithography (e-beam direct writers, coater, developer, aligner and DUV-line stepper), dielectric and polySi deposition, thickness measurement, sputtering, etch and chemical cleans, ICP-RIE, RTA and full FMA lab.

The NTC has developed state of the art nanometer scale technology for Photonic device applications. The use of proprietary e-beam lithography writing methods, in combination with high selective ICP etching, allows for accurate definition of features as low as 20 nm, and the achieving of high aspect ratio (up to 10:1) structures which are important for the definition of functionalities such as Photonic Crystals of Silicon columns, gratings or artificial textured surfaces like pyramids.

Role of UPVLC in Silicon Light

UPVLC will develop processes such UV in combination with e-beam lithography using special resists and polymers, and the use of hard-mask to achieve very-high aspect ratio features, and will fabricate accurate samples and masters of a variety of shapes and designs that will be used as substrates for the deposition of the subsequent layers needed to complete a thin-film device, and then investigate the influence of geometric parameters.